All Bids
Common13matching results. Unverified service providers can browse and view requests; only after verification can they submit quotes.
8-layer High-Speed Stackup and Impedance Design (with Simulation Report)
8-layer board with mixed PCIe Gen4 and DDR4 routing. Deliverables include stack-up design, impedance calculation, differential pair rules, SI simulation report, Allegro source files, and constraint table.
CAM Engineering Outsourcing: Gerber Cleanup, Panelization, and Drill Optimization
4 layer, 6 part numbers. Complete Gerber verification and correction, panelization, drill and solder mask compensation. Deliver production-ready engineering package with first article within 48 hours.
DFM/DFT Analysis: Manufacturability and Testability with Corrective Recommendations
Conduct DFM and DFT reviews before importing new boards to produce a prioritized issue list, remediation recommendations, and test point coverage assessment, with a focus on BGA pitch and thermal pad design.
Thermal simulation and cooling solution optimization, power board 120W
The power board 120W operates continuously; perform thermal simulation and optimize the cooling solution by evaluating copper thickness, via arrays, and heatsink selection. Deliver temperature contour maps and improvement recommendations.
EMC Remediation and Filter Circuit Design: Conducted Emissions Exceed Limits
The complete unit exceeded EMI limits by 6 dB at 150kHz-1MHz. Identify the interference path, provide filtering and PCB layout correction plans, and conduct a retest.
4 Layer Board FPC Prototype 5pcs, Impedance Control 100Ω
4-layer flexible PCB, board thickness 0.3mm, impedance 100Ω ± 10%, ENIG finish. Impedance test report required. Gerber files and stack-up structure are attached.
CAM data processing + panelization; rush order for 20 small boards
20 small boards require unified Gerber file organization, solder mask expansion, and perforated panelization for delivery within 48 hours.
8 Layer High-Frequency Board, Small Batch 50pcs, Rogers 4350B
8-layer hybrid stackup with Rogers 4350B + FR-4, impedance controlled at 50Ω single-ended and 100Ω differential. Slice report required.
Impedance Calculation and SI Simulation, DDR4 Trace Verification
DDR4 8-bit data bus: Perform impedance calculations and SI simulation reports. Identify risk points and provide optimization recommendations.
Aluminum PCB 2 layer 200pcs, thermal conductivity 2.0W
LED PCB, Aluminum substrate thermal conductivity 2.0W, board thickness 1.6mm, white solder mask, UL-certified material required.
Small-batch SMT surface mounting of 300 sets, including stencil.
300 control panel SMT assemblies, including stencil fabrication and first-article inspection; materials provided by us.
PCB electrical flying probe test 500pcs, report required
500pcs panel requires flying probe test. Output test report and defect details. Panel is in Shenzhen.
Delivery to Hanoi, Vietnam: 4 shelves, 1000pcs mass production outsourced
4 panel mass production 1000pcs, requires delivery in Hanoi, Vietnam, including customs clearance and local distribution.
